Plasma Swelling of Photoresist

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概要

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• A polymer swelling phenomenon in the hydrogen-containing freon plasma has been observed. The new polymer has a mushroom profile and is very resistant to plasma attack. The swelling rate and the new polymer structure are studied. The swelling process includes 1) new bonds formation, 2) fragments loss, and 3) hydrogenation. The top swollen part and the bottom non-swollen part were compared with the LAMMA (Laser Microprobe Mass Analysis) method. The swollen process is probably caused by the strong ion bombardment in combination with hydrogenation reactions. Possible applications of this new structure are discussed.

• 社団法人応用物理学会の論文
• 1993-01-15

著者

• Kuo Yue

  Ibm Research Division T. J Watson Research Center

• Kuo Yue

  Ibm Reseach Division T.j.watson Rsearch Center

関連論文

• Reactive Ion Etching of Sputter Deposited Tantalum with CF_4, CF_3Cl, and CHF_3
• Characterization of Indium Tin Oxide and Reactive Ion Etched Indium Tin Oxide Surfaces
• Characterization of Indium Tin Oxide and Reactive Ion Etched Indium Tin Oxide Surfaces : Etching and Deposition Technology
• Plasma Swelling of Photoresist

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