Carbon Contamination Levels in Plasma-Enhanced Chemical Vapor Deposited Fluorinated Silica Glasses
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概要
- 論文の詳細を見る
In this study, the carbon levels in fluorinated silica glass (FSG) films were investigated. FSG films were deposited using a dual-frequency sequential-deposition plasma-enhanced chemial vapor deposition (PECVD) reactor using TEOS, O_2 and C_2F_6 as source reagents. It was found that FSG films have substantially lower carbon levels than undoped PECVD TEOS-based silicon dioxide films. Carbon content was also found to be dependent on the fluorine content in the films.
- 社団法人応用物理学会の論文
- 1996-11-15
著者
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Yoo Woo
Novellus Systems Inc.
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SWOPE Richard
Novellus Systems, Inc.
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Swope Richard
Novellus Systems Inc.
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Swope R
Novellus Systems Inc. Ca Usa
関連論文
- Carbon Contamination Levels in Plasma-Enhanced Chemical Vapor Deposited Fluorinated Silica Glasses
- Plasma Enhanced Chemical Vapor Deposition and Characterization of Fluorine Doped Silicon Dioxide Films
- Intermetal Dielectric Gap Fill by Plasma Enhanced Chemical Vapor Deposited Fluorine-Doped Silicon Dioxide Films