Behavior of Thiourea Additive in the Electrodeposition Process of Iron Thin Film

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概要

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• The process of sulfur incorporation into electrodeposited iron films during the operation with thiourea as an addition agent in the plating-bath is investigated. The amounts of sulfur and iron deposited on the substrate are measured, and the rate of sulfur incorporation and the rate of iron deposition are determined. In the operation of large rate of iron deposition, it is considered that the rate of sulfur incorporation is controlled by the diffussion process of thiourea molecules near the cathode in the bath. In the operation of extremely small rate of iron deposition, it is considered that thiourea is adsorbed at the cathode, and that the reaction of thiourea molecules with ferrous ions at the cathode is the rate-controlling step for sulfur incorporation.

• 社団法人応用物理学会の論文
• 1971-05-05

著者

• SATO Masayoshi

  Department of Electronics, Faculty of Engineering, Hokkaido University

• Sato Masayoshi

  Department Of Electronics Faculty Of Engineering Hokkaido University

• Sato Masayoshi

  Department Of Anesthesiology And Intensive Care Yamagata Prefectural Shinjo Hospital

• Maeda Masao

  Department Of Electronics Faculty Of Engineering Hokkaido University

• Kuriki Shinya

  Department Of Electronics Faculty Of Engineering Hokkaido University

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