SiCとCu-Mn合金との界面反応 : セラミックスと金属との接合に関する研究(第2報)

概要

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A reactive bonding method of Cu foil to sintered SiC ceramics using Cu-Mn liquid insert alloy was reported previously (Report 1). Solid-state and liquid-state reactions of Cu-Mn/SiC were investigated in this report at heating temperatures of 500〜700℃ for 1 min and 900℃ for〜60 min using EPMA, AES and XRD. Results obtained are summarized as follows. 1) Mn concentrates to the Cu-Mn/SiC interface at heating above 600℃ (Cu-Mn is in solid state). Depth profile analysis with AES revealed that Mn reacts to SiC and releases the C, forming Mn-silicides such as Mn_5Si_3 and Mn_5Si_2. While the released C diffuses into the Mn layer. 2) Any reaction layer, except C rich layer, couldnt be observed at liquid Cu-Mn/SiC interface by heating even at a high temperature for long time (900℃, 60 min). But a phenomenon of separating and flouting into the liquid of sintered SiC grains was observed, which is considered to be caused by the preferential diffusion of Mn into grain-boundarys of sintered SiC.
社団法人溶接学会の論文
1990-08-05