Prediction of Creep Lifetime for Butt-Welded Joint of Type 304 Stainless Steel by Finite Element Method Incorporating Damage Variable
スポンサーリンク
概要
- 論文の詳細を見る
A computational method of predicting creep lifetime is presented for welded joints. In the present method, time-incremental computations of stress by a finite element method and simultaneous cumulations of a variable as a measure of creep damage are reiterated up to the critical time for the cumulative value to exceed a specified limit. This critical time is regarded as the creep lifetime. A butt-welded joint of 50 mm thick Type 304 stainless steel was prepared by SAW with depositing a 308 wire, Specimens cut from the joint were subjected to creep tests at 823 K under applied stresses of 200 to 300 MPa. The obtained data was compared with the computations. The comparison showed that the creep lifetime of the joint predicted from the computations is within the factor of two (one half to two times) of that measured.
- 社団法人溶接学会の論文
- 1995-02-05
著者
-
Hongo Hiromichi
National Institute For Materials Science
-
WATANABE Takashi
National Institute for Materials Science
-
YAMAZAKI Masayoshi
National Institute for Materials Science
-
KINUGAWA Jun-ichi
National Institute for Materials Science
-
KINUGAWA Junichi
National Research Institute for Metals
-
MONMA Yoshio
National Research Institute for Metals
-
Yamazaki Masayoshi
National Research Institute For Metals
-
Watanabe Takashi
National Institute for Agro-environmental Sciences
関連論文
- Effects of Full Annealing Heat Treatment on Long-term Creep Strength of 2.25Cr-lMo Steel Welded Joint
- Prediction of Creep Lifetime for Butt-Welded Joint of Type 304 Stainless Steel by Finite Element Method Incorporating Damage Variable
- Creep Fracture Analysis of W Strengthened High Cr Steel Weldment
- Microstructural Investigations on Type IV Cracking in a High Cr Steel
- SB-07-3(083) Effect of Microstructural Changes During Creep on The Creep Rate at 823K in Type 304 Heat Resistant Steel(Changes in Microstructure 2)
- Thermal Conductivity Measurement of Tungsten Oxide Nanoscale Thin Films
- Purification and Identification of Flavonoids from the Yellow Green Cocoon Shell (Sasamayu) of the Silkworm, Bombyx mori(Biochemistry & Molecular Biology)
- Molecular Dynamics Simulation of Thermal Conductivity of Silicon Thin Film
- Computation of Interfacial Thermal Resistance by Phonon Diffuse Mismatch Model
- Measurement of Interfacial Thermal Resistance by Periodic Heating and a Thermo-Reflectance Technique
- Creep Characteristics in Thick Welded Joints and Their Improvements (Report II) : Applicability of a Simple Model for Creep Analysis of Thick Welded Joints(Mechanics, Strength & Structure Design)
- Creep Characteristics in Thick Welded Joints and Their Improvements (Report I) : Development of A Simple Model for Creep Analysis of A Thick Welded Joint(Mechanics, Strength & Structure Design)
- Development of an Internet System for Composite Design and Thermophysical Property Prediction
- Some Experiments with a New-Designed Fricition Welding Machine
- Microstructures and Type-IV Creep Damage of High Cr Steel Welds
- Rapid and simple colorimetric assay for detecting the enzymatic degradation of biodegradable plastic films(METHODS)
- Xylose induces the phyllosphere yeast Pseudozyma antarctica to produce a cutinase-like enzyme which efficiently degrades biodegradable plastics(ENVIRONMENTAL BIOTECHNOLOGY)
- Rapid and simple colorimetric assay for detecting the enzymatic degradation of biodegradable plastic films