チタンとニッケルのろう付過程における反応機構

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A commercially pure titanium has been liquid phase diffusion bonded to pure nickel by using amorphous alloy filler metal. The dissolution phenomenon of the base metals into the liquid filler metal and the isothermal solidification process during bonding was investigated. Main experimental results obtained in this reserch are as follows ;(1) The dissolution phenomenon of the base metals into the liquid filler metal was completed rapidly, its time was about 60 sec at 1125 and 1150 K, and about 120 sec at 1200 K.(2) The dissolution of titanium base metal shown a value three times as much the dissolution of nickel base metal into the liquid filler metal. The maximum dissolution width of the base metals were related to the boning temperature by the following equations. W_<DTi>=(1.78×10^<-6>×T)-(1.99×10^<-3>), W_<DNi>=(4.85×10^<-7>×T)-(5.37×10^<-4>)(3) The relation between dissolution parameter P of the base metals and bonding time dose not shown by the straight line relation, the dissolution process was divided into three stage according to the dissolution rate constant K. therefor, the dissolution phenomenon does not conformed to the Nernst-Brunner's theory.(4) The concentration of each elements were distributed itself uninformly throughout the bonded interlayer after the dissolution phenomenon of the base metals was completed.(5) The maximum width of the bonded interlayer was related to the boning temperature by the following equation. W_<BImax>=(2.32×10^<-6>×T)-(2.55×10^<-3>)(6) The Ti-Cu and Ti-Ni system intermetallic compound layers formed on the interface of titanium base metal to the bonded interlayer. The Ti-Ni system intermetallic compound layer formed on the interface of nickel base metal to the bonded interlayer.
2000-05-05

チタンとニッケルのろう付過程における反応機構

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