Atomic Vapor Deposition of SBT and Electrode Materials
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概要
- 論文の詳細を見る
AIXTRON offers an Atomic Vapor Deposition (AVD[○!R]) Tricent[○!R] production equipment for the deposition of multicomponent Oxide and Electrode materials on large wafers. It utilizes a pulsed injection of up to four liquid precursors into a precisely heated TriJet[○!R] vaporizer. Results for ferroelectric SBT layers as well as conducting Pt, Ru, and RuO_2 layers are presented. An excellent remanent polarization and layer uniformity of SBT is achieved using the AVD[○!R] technology. Electrode Materials deposited with AVD[○!R] show near bulk-like electrical conductivity and excellent step coverage.
- 社団法人電子情報通信学会の論文
- 2004-03-10
著者
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Mcmillan L
Symetrix Corporation
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Mcmillan Larry
Symetrix Corporation
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Araujo Carlos
Symetrix Corporation
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Schumacher Marcus
Aixtron K. K.
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Lohe Christoph
AIXTRON K. K.
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Lindner Johannes
AIXTRON K. K.
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Baumann Peter
AIXTRON K. K.
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Solayappan Narayan
Symetrix Corporation
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Laetz Kurt
Symetrix Corporation
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Solayappan Narayan
AIXTRON K. K.
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de Araujo
AIXTRON K. K.
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Laetz Kurt
AIXTRON K. K.
関連論文
- Application of Ferroelectric Thin Films to Si Devices (Special Issue on Quarter Micron Si Device and Process Technologies)
- Atomic Vapor Deposition of SBT and Electrode Materials
- Metal-Organic Chemical Vapor Deposition and Characterization of Strontium Bismuth Tantalate(SBT)Thin Films
- Preparation of Ferroelectric Thin Films of Bismuth Layer Structured Compounds