A Consideration for Oscillating Increase of Contact Resistance Between Gold and Copper in the Process of Oxidizing (国際セッションIS--EMD 2003) -- (Session 1 Contact phenomena(1))

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概要

• 論文の詳細を見る

• Contact resistances between gold wire and copper block which surface was oxidized from clean state to 200nm thickness were measured. Those contact resistances showed oscillating increase and finally reached to very high value at 200nm. In this paper, a consideration that diffusing process of oxygen molecules toward inside the copper block is not simple, but bonding between copper and oxygen cause insulating layers and semi-conducting layers, is presented.

• 一般社団法人電子情報通信学会の論文
• 2003-11-13

著者

• Minowa I

  Tamagawa Univ. Machida‐shi Jpn

• Minowa Isao

  Electronic Engineering Tamagawa University

• Gotoh Masahiko

  Electronic Engineering Tamagawa University

• TANAKA Takahito

  Electronic Engineering, Tamagawa University

• Tanaka Takahito

  Electronic Engineering Tamagawa University

関連論文

• Nonlinear Characteristics of Insulating LB Films with Nanometer Thickness Sandwiched between Au-Au Contact
• Thermo-electromotive force of Cu-Cu contact for precision measurements (国際セッションIS-EMD2002〔英文〕)
• A Consideration for Oscillating Increase of Contact Resistance Between Gold and Copper in the Process of Oxidizing (国際セッションIS--EMD 2003) -- (Session 1 Contact phenomena(1))
• A Consideration for Oscillating Increase of Contact Resistance Between Gold and Copper in the Process of Oxidizing

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