A Consideration for Oscillating Increase of Contact Resistance Between Gold and Copper in the Process of Oxidizing

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概要

• 論文の詳細を見る
• 2003-11-13

著者

• Minowa I

  Tamagawa Univ. Machida‐shi Jpn

• Minowa Isao

  Electronic Engineering Tamagawa University

• Gotoh Masahiko

  Electronic Engineering Tamagawa University

• TANAKA Takahito

  Electronic Engineering, Tamagawa University

• Tanaka Takahito

  Electronic Engineering Tamagawa University

関連論文

• Nonlinear Characteristics of Insulating LB Films with Nanometer Thickness Sandwiched between Au-Au Contact
• Thermo-electromotive force of Cu-Cu contact for precision measurements (国際セッションIS-EMD2002〔英文〕)
• A Consideration for Oscillating Increase of Contact Resistance Between Gold and Copper in the Process of Oxidizing (国際セッションIS--EMD 2003) -- (Session 1 Contact phenomena(1))
• A Consideration for Oscillating Increase of Contact Resistance Between Gold and Copper in the Process of Oxidizing

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