An Effective Defect-Repair Scheme for a High Speed SRAM (Special Issue on LSI Memories)
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概要
- 論文の詳細を見る
To make a fast Bi-CMOS SRAM yield high without speed degradation, three defect-repair methods, the address comparison method, the fuse decoder method and the distributed fuse method, were considered in detail and their advantages and disadvantages were made clear. The distributed fuse method is demonstrated to be further improved by a built-in fuse word driver and a built-in fuse column selector, and fuse analog switches. This enhanced distributed fuse scheme was examined in a fast Bi-CMOS SRAM. A maximum access time of ns and a chip size of 8.8mm×17.4mm are expected for a 4 Mb Bi-CMOS SRAM in the future.
- 社団法人電子情報通信学会の論文
- 1993-11-25
著者
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UCHIDA Hideaki
Laboratory of Animal Products Chemistry, Graduate School of Agricultural Science, Tohoku University
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Uchida Hideaki
Laboratory Of Animal Products Chemistry Graduate School Of Agricultural Science Tohoku University
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Uchida Hideaki
Semiconductor & Integrated Circuits Div. Hitachi Ltd.
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Aoki Hideyuki
Semiconductor & Integrated Circuits Div. Hitachi Ltd.
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Ookuma Sadayuki
Device Development Center, Hitachi Ltd.
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Sato Katsuyuki
Device Development Center, Hitachi Ltd.
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Ide Akira
Semiconductor & Integrated Circuits Div., Hitachi Ltd.
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Akioka Takashi
Hitachi Research Lab., Hitachi Ltd.
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Ide Akira
Semiconductor & Integrated Circuits Div. Hitachi Ltd.
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Akioka Takashi
Hitachi Research Lab. Hitachi Ltd.
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Ookuma Sadayuki
Device Development Center Hitachi Ltd.
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Sato Katsuyuki
Device Development Center Hitachi Ltd.
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