Practical Design and Modeling Procedure of Test Structures for Microwave Bare-Chip Devices(Microwaves, Millimeter-Waves)

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概要

• 論文の詳細を見る

• This paper presents practical modeling procedure of feed patterns, bond wires, and interconnects for microwave bare-chip devices. Dedicated test structures have been designed for the process. Modeling accuracy of BJTs and diodes has been unprecedentedly improved up to 30 GHz with this procedure despite popular SPICE models were used.

• 社団法人電子情報通信学会の論文
• 2004-01-01

著者

• SHIMASUE Masanori

  MODECH Inc.

• AOKI Hitoshi

  MODECH Inc.

• Shimasue M

  Modech Inc.

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• Practical Design and Modeling Procedure of Test Structures for Microwave Bare-Chip Devices
• Practical Design and Modeling Procedure of Test Structures for Microwave Bare-Chip Devices(Microwaves, Millimeter-Waves)

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