High-Resolution Wafer Inspection Using the "in-lens SEM" (Special Issue on Scientific ULSI Manufacturing Technology)
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概要
- 論文の詳細を見る
A new electron-beam wafer inspection system has been developed. The system has a resolution of 5 nm or better, and is applicable to quarter-micron devices such as 256 Mbit DRAMs. The most remarkable feature of this system is that a specimen stage is built in the objective lens and allows a working distance (WD) of 0. "WD=0" minimizes the effect of lens aberrations, and maximizes the resolving power. Innovative designs to achieve WD=0 are as follows: (1) A large objective lens of 730-mm width × 730-mm depth × 620-mm height that serves as a specimen chamber, has been developed. (2) A hollow specimen stage made of non-magnetic materials has been developed. It allows the lower pole piece and magnetic coile of the objective lens inside it. (3) Acoustic motors made of non-magnetic materials are employed for use in vacuum.
- 社団法人電子情報通信学会の論文
- 1996-03-25
著者
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Yamada S
Advanced Device Development Gr. Elpida Memory Inc.
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Mizuno F
Instrument Division Hitachi Ltd.
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Mizuno Fumio
Instrument Division Hitachi Ltd.
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Mizuno Fumio
Mitsubishi Chemical Safety Institute
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Yamada S
Department Of Periodontology Tokyo Dental College
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YAMADA Satoru
Device Development Center, Hitachi, Ltd.
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OHTAKA Tadashi
Instrument Division, Hitachi, Ltd.
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TSUMAKI Nobuo
Mechanical Engineering Research Laboratory, Hitachi, Ltd.
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K0IKE Toshifumi
Mechanical Engineering Research Laboratory, Hitachi, Ltd.
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Tsumaki Nobuo
Mechanical Engineering Research Laboratory Hitachi Ltd.
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Ohtaka Tadashi
Instrument Division Hitachi Ltd.
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K0ike Toshifumi
Mechanical Engineering Research Laboratory Hitachi Ltd.
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Yamada Satoru
Device Development Center Hitachi Ltd.
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