A NEW CHEMICAL MECHANICAL POLISHING METHOD USING THE FROZEN ETCHANT PAD

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概要

• 論文の詳細を見る

• We have developed the new-concept CMP process named as the Forzen Chemical Etching (FCE) process, which uses a frozen etchant pad instead of conventional slurries and polymer pads. Bacause the polishing has been processed without the slurries and porous pad, we believe that the current difficulties in the conventional CMP process are possible solved. The performance of the frozen etchant polishing is strongly dependent on the chemical composition of the frozen etchant pad and the process temperatures. In our preliminary experimental results, we found that this new process concept should be applicable to the future device manufacturing technologies in microelectronics fabrication.

• 社団法人電子情報通信学会の論文
• 2001-06-28

著者

• Oh Youn-jin

  Dept.of Chemical Engineering Sungkyunkwan University

• Jung Tae

  Hynix Semiconductor Inc.

• Ryu Jae-ok

  Hynix Semiconductor Inc.

• Chung Chan-hwa

  Dept.of Chemical Engineering Sungkyunkwan University

• Park Gyung-soon

  Dept.of Chemical Engineering Sungkyunkwan University

• Park Sung

  Fine Semitech Co. Ltd.

• Kim Il-Wook

  Hynix Semiconductor Inc.

• Chung Chan-Hwa

  Fine Semitech Co., Ltd.

関連論文

• A NEW CHEMICAL MECHANICAL POLISHING METHOD USING THE FROZEN ETCHANT PAD
• A NEW CHEMICAL MECHANICAL POLISHING METHOD USING THE FROZEN ETCHANT PAD
• A New Chemical Mechanical Polishing Method Using the Frozen Etchant Pad (2001 Asia-Pacific Workshop on Fundamental and Application of Advanced Semiconductor Devices(AWAD 2001))

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