402 コロナ吸着によるフィルムハンドリング技術の開発

概要

論文の詳細を見る
Lamination technology using the resist film is widely applied to form the circuit pattern on the substrate in manufacturing process of PCB (Printed Circuit Board) and FPD (Flat Panel Display). The film used in this process has the multi-layer structure which consists of the photosensitive resist sandwiched by the protect polymer film and the based one. The conventional lamination technologies have some problems. For example, air bubbles remain in the resist film, which is a serious problem making a poor substrate. It causes by the film which falls on the surface of the substrate involved air bubbles before the attachment. In order to such a problem, the new technology was developed, which is the holding method of the film by the attraction due to the corona discharge. developed technology makes the accurate attachment without air bubbles, and the remarkable improvement in the process of PCB and FPD.
一般社団法人日本機械学会の論文
2003-09-19