607 超塑性セラミックス原料粉末をインサートに用いたセラミックスの低温固相接合(オーガナイズドセッション : 超成形・超塑性と材料)

概要

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In solid state bonding which uses the superplastic ceramics powders as an insert, the bonding at the low temperature can reduce residual stress and grain growth. In addition, it is useful from the viewpoint of the improvement in the industry applicability. In this study, the bonding at low temperatures is carried out, and appropriate bonding parameters are clarified. The experimental joining pressure bonding, time as a variable, and observation of the bonded conditions and measurement of the bond strength were carried out. The result have shown that it obtained the almost equal strength at bonding joined material Si_3N_4 with the bonding in the high temperature and that the bonding at the low temperature is very effective.
2000-09-08