H215 ENHANCEMENT OF HEAT TRANSFER FROM AN AIR-COOLED MODULE BY MEANS OF HEAT SPREADING IN THE BOARD(Electronics cooling-3)

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概要

• 論文の詳細を見る

• Conjugate heat transfer from a surface mounted module(31x31x7 mm^3) on the substrate to channel airflow(1-7m/s) was studied experimentally. The convective thermal conductance for the path from the module surface directly to airflow and conjugate thermal conductance for the path leading from the module to the floor by way of a module support, then, to the air flow were determined with several combinations of module-support-construction(210, 0.32, 0.021 ℃/W) /floor-material(398, 0.236W/m℃ and channel height (15-30 mm). As the result, it was found that the conjugate thermal conductance and the temperature distribution around the module depend on the thermal resistance of the module support, and the channel height. These configurations were designed to investigate on the feasibility of using the substrate as an effective heat spreader in the forced convective air-cooling of surface mounted heat source. The experimental results were discussed in the light of interactive nature of heat transfer through two paths, one directed from the module to the airflow and the other via the module support and the floor to the air.

• 一般社団法人日本機械学会の論文
• 2000-10-01

著者

• Hong Taek

  Department Of Mechanical Engineering Kum-oh National University Of Technology

• Park Sanig

  School of Mechanical Engineering, Kum-oh National University of Technology

• Nakayama Wataru

  ThermTech International

• Nakayama Wataru

  Therm Tech International

• Park Sanig

  School Of Mechanical Engineering Kum-oh National University Of Technology

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