TED-AJ03-566 The Build-up Approach to Combat Complexity and Uncertainties in Thermal Analysis of Compact Electronic Equipment : A JSME Project
スポンサーリンク
概要
- 論文の詳細を見る
In order to expedite thermal design of electronic equipment a hierarchical organisation of the design work is proposed. In the knowledge development phase, the computational fluid dynamics (CFD) simulation is performed on a set of template designs. From the solution body a fast-to-use design code will be developed for use in the actual design phase. In order to materialise this concept a project is in progress in the Japan Society of Mechanical Engineers. This paper describes an overall design of the project and key ingredients in the algorithmic base of the proposed methodology.
- 一般社団法人日本機械学会の論文
著者
関連論文
- H215 ENHANCEMENT OF HEAT TRANSFER FROM AN AIR-COOLED MODULE BY MEANS OF HEAT SPREADING IN THE BOARD(Electronics cooling-3)
- TED-AJ03-566 The Build-up Approach to Combat Complexity and Uncertainties in Thermal Analysis of Compact Electronic Equipment : A JSME Project
- B15-011 A NOVEL OPPORTUNITY FOR THE ART OF GEOMETRIC MODELING IN THE DEVELOPMENT OF MICRO-THERMAL ENGINEERING