H105 INDIRECT FLUORINERT COOLING OF NOTEBOOK COMPUTERS WITH HIGH-POWER IC CHIPS(Electronics cooling-1)

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概要

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• Indirect Fluorinert cooling of high-power IC chips using a closed type thermosyphon loop was fundamentally investigated to cope with the recent rapid rise in the heat dissipation density of notebook computers. The present experimental set-up consists of evaporator and condenser sections connected by flexible tubing. The evaporator section corresponds to a high-power IC chip, and the condenser section represents a cooling plate located behind a display of notebook computers. The evaporator has a size of 50mm × 50mm × 20mm for the outside dimensions, and the condenser is made of a copper plate with a heat transfer area of 150 × 200mm^2 and a thickness of 1.5mm. The effects of the heat input, the filled volume of Fluorinert liquid (or the filled volume ratio of Fluorinert liquid) and the inclination angle of the condenser concerning the heat transfer characteristics of the system were studied experimentally. Further, an experiment which enhanced boiling in the evaporator was also carried out.

• 一般社団法人日本機械学会の論文
• 2000-10-01

著者

• Gima S.

  Department Of Mechanical Systems Engineering University Of The Ryukyus

• Zhang X.

  Institute Of Dermatology Department Of Dermatology At First Hospital Anhui Medical University

• Tomimura T.

  Institute Of Advanced Material Study Kyushu University

• Fujii M.

  Institute of Advanced Material Study, Kyushu University

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