SA-08-5(025) Measurement of Micro-Creep Deformation using Electron Moire Method(Flaw Progress & Failure Mechanism 1)
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概要
- 論文の詳細を見る
Local creep deformation was measured and analyzed using the electron Moire method. Fine electron-sensitive micro-grids of an alloy of gold and palladium were fabricated on the surface of rectangular specimens. Interrupted creep tests of pure copper were carried out in an argon atmosphere. The local creep deformation was determined by forming Moire fringes in a scanning electron microscope. The measurement of the micro-creep deformation and detailed observations show that the local distribution of creep strain inside the grains is non-uniform. The relationship between the strain distribution, grain boundary sliding and creep time was used studied. This method was applied to estimate the creep damage and predict the residual life of structural components for high temperature use. In addition, the replica method was also used to observe the electron Moire fringes.
- 一般社団法人日本機械学会の論文
- 2001-06-03
著者
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KISHIMOTO Satoshi
Hybrid Materials Research Center, National Institute for Materials Science
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Kishimoto Satoshi
Intelligent
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Kishimoto Satoshi
National Institute For Materials Science
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Kishimoto Satoshi
Hybrid Materials Research Center National Institute For Materials Science
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Kishimoto Satoshi
5th Research Group National Research Institute For Metals
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Kyono Junro
Smart Materials Group National Institute For Materials Scienc
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Kyono Junro
Materials Engineering Laboratory National Institute For Materials Science
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Kyono Junro
Material Engineering Laboratory National Institute For Materials Science
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Shinya Norio
Intelligent
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Shinya Norio
Materials Engineering Laboratory National Institute For Materials Science
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Shinya Norio
Material Engineering Laboratory National Institute For Materials Science
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Kishimoto Satoshi
Materials Engineering Laboratory, National Institute for Materials Science
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