344 分散強化Cu-SiO_2合金単結晶の疲労と温度依存性(OS フレッティング摩耗と疲労)

概要

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Copper single crystals with dispersed sphere SiO_2 particles were cyclically deformed at the temperatures between 298K and 687K. Cu-SiO_2 alloy samples showed longer life compared with pure copper single crystals irrespective of temperature and stress amplitude. This would be due to matrix strengthening not only by dispersion but also by the development of cell structure with nodes of the dispersed particles. Occurrence of relaxation around the Cu/SiO_2 interface at higher temperatures lowered stress-amplitude dependency of slope (Δε/ ΔlogN), which corresponds to fatigue creep. Though voids were frequently observed to nucleate at SiO_2/ interfaces at higher stage of cycles, such small voids nucleated at the interfaces seemed not to remarkably correspond to shorten the life.
2000-11-24