最小膜沸騰温度に及ぼす被覆材質の影響

概要

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This paper deals with the effect of the thermal conductance of a coating material on minimum film boiling temperature T_<min>. The earlier one-dimensional model is upgraded to treat the effect of two-dimensional heat conduction on temperature transients associated with intermittent liquid-solid contacts in the film boiling regime. For low thermal conductivity of the coating material, T_<min> becomes higher with increasing coating thickness since the transient contact and subsequent evaporation of a thin microlayer of liquid bring forth a rapid decrease in local surface temperature even though the average wall temperature is quite high. For high thermal conductivity, however, T_<min> slightly decreases with a thicker coating. This is attributed to two-dimensional heat conduction of the coating material, which prevents the surface temperature from decreasing at liquid-solid contacts.
社団法人日本機械学会の論文
1990-07-25