木材の圧電温度分散について

概要

論文の詳細を見る
The temperature disperison of complex piezoelectic modulus of wood occuring at about 100℃ was investigated. The results obtained were as follow: (1) The apparent activation energy was about 40-50 kcal/mol, suggesting that the origin of the piezoelectric dispersion is caused by molecular motions of conssiderably large units. The disperision temperature for each species was different. In the species the disperison temperature was low near the pith and high at outer parts. The dispersion temperature increased with the increase of the degree of crystallinity. It is presumed that the disperison is related to the semicrystalline state in wood. (2) With heat treatment, the dispersion temperature increased initially and then decreased considerably, and the amplitude of the dispersion became smaller gradually. (3) With the increased of water absorption, the imaginary part of the piezoelectric constant became, negative and the dispersion temperature increased. It may be considered that the shift of the disperison temperature toward higher temperature is related to the formation and modification of semicrystalline state in wood caused by heart treatment and water absorption.
社団法人日本材料学会の論文
1985-08-15