ランダム温度変動下でのピーク応力による疲労き裂進展寿命分布

概要

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Fatigue crack growth under thermal fluctuation is theoretically investigated by the use of a Markov approximation method, under the condition that the temporary variation of the inner surface temperature of the plate can be modeled as a narrow-band stationary process. First, under an assumption that the peak stress causes the crack growth, a crack growth equation is formulated based upon the Paris'law and it is extended to a rondom differential equation, in which the random variation of crack propagation resistances are also taken into account. Next, a residual life distribution as well as a probability distribution function of the crack growth processes is derived. Finally, some numerical examples are shown to examine the quantitative behavior of the residual life distribution in the high-reliability region. The result indicates that the residual life in such a region is of order of 10^8 cycles.
社団法人日本材料学会の論文
1994-01-15