コロイドプロセスによるCu内包SnO_2マイクロカプセルの合成と半導性ガラス複合体への応用

概要

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SnO_2 microcapsules containing Cu were synthesized by an interfacial reaction method using W/O type emulsion with dispersing phases including Cu spherical particles. The microcapsules with different SnO_2/Cu ratios were prepared and used as electrical conductive components of semiconductive glass composites. The effect of the SnO_2/Cu ratio on the electrical properties of the glass composite was investigated by comparing with glass composites fabricated with Cu and SnO_2 powders. The SnO_2 microcapsule with average particle size of 2.73μm was obtained. The wall of the microcapsule had about 0.65μm thickness and consisted of about 15 particle layers of fine SnO_2 particles of 0.05μm. The electrical properties of the glass composites with the SnO_2 microcapsules had small dependence on the SnO_2/Cu ratio. The glass composite with relatively small temperature dependence of electrical resistance was obtained because a good compensating effect between SnO_2 and Cu on the electrical properties of the glass composites would appear by the use of the microcapsules. On the other hand, the glass composites using SnO_2 and Cu powders had large compositional dependence of the electrical properties, and showed metallic properties at about 25vol% Cu.
社団法人日本材料学会の論文
2000-05-15