パーティクルボードのはく離試験におけるAE発生挙動 : とくにボードの内部構造要因の影響(特集木質材料)

概要

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This investigation was concerned with the effect of internal structure factor of particleboard on the characteristics of acoustic emission (AE) during internal bond testing. The tensile tests perpendicular to the plane of board were conducted with the aid of AE monitoring system for handmade particleboards having various internal structure factors, such as particle size, board density, board thickness and resin content. Especially, the effects of particle size on the internal bond strength and AE generation behavior were studied. The tensile strength (IB) of particleboard was affected by particle size, board density, board thickness, resin content and schedule of hot-pressing. Generally, the higher the value of IB was, the more the cumulative AE event counts (T_AE) were monitored; therefore, it was considered that IB was closely related to T_AE. The ratio (R_a) of the stress level at the initiation of AE generation (σ_G) to that at failure (IB) was negatively correlative to either of IB or T_AE. Furthermore, from the results of AE measurement with several threshold levels, it was confirmed that the particleboard made of larger particles generated higher amplitude and more AE_s than that made of smaller particles. And it was also confirmed that σ_G was higher in the board made of smaller particles, because of reduction of amplitude of AE to be detected with AE sensor.
社団法人日本材料学会の論文
1997-04-15