Nanoscale Impact Dynamics Using Molecular Dynamics Simulation
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概要
- 論文の詳細を見る
Molecular dynamics simulation is used to investigate dynamic impact behavior at the nanoscale. The classic many-body tight-binding potential is employed to model the atomic force acting between atoms. The impact model of a Cu sphere cluster hitting a Cu substrate is established. Investigated issues include dynamic cluster/substrate interactions, substrate deformation, substrate fracture characteristics, force transmission, energy transformation between cluster and substrate, cluster motion characteristics, debris cloud formation characteristics, and the characteristics of the dynamic impact behavior at different cluster incident energies. The results show that an elastic necking phenomenon behavior is found for the case of clusters landing at the relatively low incident energy of 0.1 eV/atom. The phenomenon of impact hole recovery, which is the result of interatomic attractive forces applied by the substrate on the cluster atoms, is observed at an incident energy of 2eV. In this situation, the cluster atoms join those of the substrate. At the higher incident energies of 5 and 50eV, a significant number of the substrate atoms dissociate themselves from the substrate structure and form a debris cloud. Additionally, it is determined that unlike lower incident energy impacts, substrate deflection docs not occur immediately upon cluster penetration of the substrate for elevated incident energies. Finally, it is found the substrate removal rate is a key factor in determining the distribution density of the debris cloud.
- 社団法人日本物理学会の論文
- 2003-03-15
著者
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Ju Shin-pon
Department Of Mechanical Engineering National Cheng Kung University
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HWANG Chi-Chuan
Department of Engineering Science, National Cheng Kung University
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CHANG Jee-Gong
National Center for High-performance Computing
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SU Ming-Horng
Department of Mechanical Engineering, Wu Feng Institute of Technology
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Su Ming-horng
Department Of Fire Science Wufeng Institute Of Technology
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Su Ming-horng
Deparment Of Mechanical Engineering Wu Feng Institute Of Techology And Engineering
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Su Ming-horng
Department Of Mechanical Engineering Wu Feng Institute Of Technology
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Hwang Chi-chuan
Department Of Engineering Science National Cheng Kung University
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Chang Jee-gong
National Center For High-performance Computing National Applied Research Laboratories
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Hwang C‐c
National Cheng Kung Univ. Tainan Twn
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