サンドブラスト法によるビルドアップ基板の IVH 形成
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概要
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Now a days many PCB companies are trying to improve "build up" technology not only for PCBs but also for packaging technology. Today photo via by photo solder resist method is the most popular for producing IVH, but the characteristics needed for insulation layers, for example high Tg and low dielectric constant, are very demanding and Photo Via cannot meet these high performance needs. To meet these needs, non-photosensitive insulation resin can improve the characteristics easily. Therefore, the industry is now looking at LASER DRILLING as alternate IVH production technology. TOK (TOKYO OHKA KOGYO CO., LTD.) has developed another new IVH manufacturing method that uses sandblasting to etch the insulation layer. This method is called the "SB-Via PROCESS". We have developed a special dry film, "ORDYL-SV", and a special non-photosensitive insulation resin, "SV-R RESIN", and we have designed the equipment for this process.
- 社団法人エレクトロニクス実装学会の論文
- 1998-05-01
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関連論文
- ビルドアップ配線板用絶縁材料の現状と課題((1) 材料技術, 2. ビルドアップ配線板の現状)(ビルドアップ配線板の現状と将来 : その可能性と限界は?)
- サンドブラスト法によるビルドアップ基板の IVH 形成
- ビルドアップ配線板用光硬化性絶縁材料