単結晶Siの超精密切削における切りくず形態

概要

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Material removal behavior of single crystal silicon in ultra-precision diamond turning is experimentally studied. Microscopic chip morphology is investigated to clarify the brittle-ductile transition mechanism. A straight-nosed diamond tool is used to obtain the uniform chip thickness along the cutting edge. Three dominant types of chips are observed under different undeformed chip thickness. In the brittle regime, irregular grain chips and pitted surface are formed by cleavage fracture. As an intermediate regime, periodical shear deformation occurs with producing line chips and striated surface. The chip formation phenomenon in the ductile regime is confirmed to be similar , to that of metal cutting, where continuous ribbon chips and perfectly transcribed surface can be obtained. Moreover, the crystallographic anisotropy effects in the chip morphology are found.
公益社団法人精密工学会の論文
1999-07-05