磁気ディスク基板の研磨加工 : 基板うねり部加工特性

概要

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This paper deals with decreasing characteristics of disk substrate undulation by grinding. An attempt was made to analyze the decreasing quantity of undulation, when changing grinding conditions. In the analysis, a formula on the pressure distribution between disk substrate undulation and grindstone was derived from Hertz's formula. An equation about the decreasing quantity of undulation was derived involving the pressure distribution. Calculated decreasing quantities of undulation were in agreement with experimental results. This means that undula-tion can be decreased by pressure inequalities between undulation peak and outskirts. The decreasing characteristics of undulation which has been conceptually considered can be explained well by the derived equation. The grinding conditions of disk substrate are discussed. In order to decrease the undulation with a little stock removal quantity at short grinding time, the disk substrate should be ground with low pressure and with high relative velocity.
公益社団法人精密工学会の論文
1985-09-05