Colloidal Silica 添加電解液および陰極の Pre-Coating による銅電着層の組織変化

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This study examined changes in the crystal structure, the surface morphology and the crystalorientation of electrodeposited film that is extracted from the negative electrode using Aupre-coating and the dispersed plating method that adds colloidal silica (Si02 suspension) as adispersant to a copper sulfate electrolytic bath. Because of silica dispersion and Au pre-coating,the crystal particles on the film became fine and made uniform, and the number of particles alsoincreased. In addition, the hardness of copper electrodeposited film rose by around 15% becauseof the dispersion effect of colloidal silica. Furthermore, planes (111), (200) and (311) of X-raydiffraction pattern on the copper electrodeposited film that dispersed colloidal silica almostdisappeared, so the preferred orientation changed from plane (111) to (110).
秋田大学の論文