プリント配線板のイオンマイグレーションと絶縁信頼性評価法

概要

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Insulation reliability is considered to be very important nowadays with wider application of fine pitch printed wiring boards. The main for insulation deterioration is ion migration whereby conductor metal dissolves into insulation layer due to electrochemical reaction at the state of high humidity. Therefore, this study forcuses on origin and development of the migration and its prevention measures. Also we discuss the points to be noticed about the evaluation of insulation life time due to migration. The results of this study are : (1) The probability of ion migration depends on the type of metal. And it is explained by referring to the ionized sphare of the potential-pH diagram. Also the migration patterns are classified to two types. The most frequent type originates from the anode electrode. The second type originates from the cathode electrode. (2) The test condition of accelerated tests for evaluation of life time has the upper limit on the relation of equivalence.
東海大学の論文