酸化物分散銅合金のイオン照射による組織発達

概要

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Oxide dispersion strengthend copper (ODS-Cu) alloys Glidcop CuAl15, CuAl25 and Cu-Cr-Zr alloy, were irradiated with Cu$^{2+}$ ions at 573-773K up to dose of 30 dpa. Void swelling was observed in all specimens irradiated in the temperature range between 573K and 673K. In CuAl15 brazed with graphite at 1083K, mean size of grain was about 800nm. Voids were formed in large grains over 1 $\mu$m but not in grains less than 500nm. In CuAl25 jointed with SUS316 by Hot Isostatic Pressing (HIP) at 1253K, on the other hand, mean size of grain was order of 10 $\mu$m because of remarkable grain growth during HIP at 1253K and showed large void swelling. Small grain size is essential for the suppression of void swelling due to strong sink effects of grain boundaries for the point defects. The Cu-Cr-Zr alloy brazed with graphite at 1083K exhibits less void swelling than other copper alloys in this study. Because of temperature increase during silver brazing, Cu$_5$Zr precipitates were observed. The present results indicate that the control of jointing temperature is essential.
2001-09-30