Effect of Crystal Orientation on Sn Whisker-Free Sn-Ag-Cu Plating
スポンサーリンク
概要
- 論文の詳細を見る
- 2012-12-01
著者
-
SUGANUMA Katsuaki
The Institute of Scientific and Industrial Research, Osaka University
-
Suganuma Katsuaki
The Institute Of Scientific And Industrial Research Osaka University
-
MIZUGUCHI Yukiko
Advanced Materials Laboratories, Sony Corporation
-
MURAKAMI Yosuke
Advanced Materials Laboratories, Sony Corporation
-
TOMIYA Shigetaka
Advanced Materials Laboratories, Sony Corporation
-
ASAI Tadashi
Core Technology Division, Sony EMCS Corporation
-
KIGA Tomoya
Core Technology Division, Sony EMCS Corporation
関連論文
- Transmission Electron Microscopy Study on Microstructure of Ag-Based Conductive Adhesives
- A Super-Flexible Sensor System for Humanoid Robots and Related Applications(Selected Papers in ICEP 2007)
- 609 Carburization of TiAl alloys by reactive plasma process at elevated temperatures
- Direct Surface Modification of Zirconium by Reactive Plasma Processing at Elevated Temperatures
- A study on solder electromigration in Cu/In/Cu flip-chip joint system (特集 TCEP2007英文論文集)
- Development of an Electrophoretic Sol-Gel Coating Process for Porous Metals
- Effect of Crystal Orientation on Sn Whisker-Free Sn-Ag-Cu Plating