Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of Sn-Ag-Cu Joints

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概要

• 論文の詳細を見る
• 2012-12-01

著者

• Kariya Yoshiharu

  Department Of Materials Science And Engineering Shibaura Institute Of Technology

• Kanda Yoshihiko

  Graduate School Of Shibaura Inst. Of Technol.

• TASAKA Takeshi

  Department of Materials Science and Engineering, Shibaura Institute of Technology

関連論文

• Influence of Temperature and Dwelling Time on Low-Cycle Fatigue Characteristic of Isotropic Conductive Adhesive Joint
• Effect of Hold Time on Low Cycle Fatigue Life of Micro Solder Joint
• Influence of Crystallographic Orientation on Fatigue Reliability of β-Sn and β-Sn Micro-Joint
• Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of Sn-Ag-Cu Joints

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