Influence of Temperature and Dwelling Time on Low-Cycle Fatigue Characteristic of Isotropic Conductive Adhesive Joint
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概要
- 論文の詳細を見る
- 2010-10-01
著者
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Kariya Yoshiharu
Department Of Materials Science And Engineering Shibaura Institute Of Technology
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KANDA Yoshihiko
Graduate School of Shibaura Institute of Technology
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IGUCHI Keitaro
Graduate School of Shibaura Institute of Technology
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FURUSAWA Hiromitsu
Department of Materials Science and Engineering, Shibaura Institute of Technology
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Kanda Yoshihiko
Graduate School Of Shibaura Inst. Of Technol.
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Furusawa Hiromitsu
Department Of Materials Science And Engineering Shibaura Institute Of Technology
関連論文
- Influence of Temperature and Dwelling Time on Low-Cycle Fatigue Characteristic of Isotropic Conductive Adhesive Joint
- Effect of Hold Time on Low Cycle Fatigue Life of Micro Solder Joint
- Influence of Crystallographic Orientation on Fatigue Reliability of β-Sn and β-Sn Micro-Joint
- Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of Sn-Ag-Cu Joints