Effect of Hold Time on Low Cycle Fatigue Life of Micro Solder Joint
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2008-07-01
著者
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Kariya Yoshiharu
Materials Science And Engineering Department Shibaura Institute Of Technology
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Kanda Yoshihiko
Graduate School Of Shibaura Inst. Of Technol.
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KANDA Yoshihiko
Materials Science and Engineering Department, Shibaura Institute of Technology
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MOCHIZUKI Yusuke
Materials Science and Engineering Department, Shibaura Institute of Technology
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Mochizuki Yusuke
Materials Science And Engineering Department Shibaura Institute Of Technology
関連論文
- Influence of Temperature and Dwelling Time on Low-Cycle Fatigue Characteristic of Isotropic Conductive Adhesive Joint
- Effect of Hold Time on Low Cycle Fatigue Life of Micro Solder Joint
- Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of Sn-Ag-Cu Joints