Ferrite Formation Behaviors from B1 Compounds in Steels
スポンサーリンク
概要
- 論文の詳細を見る
- 2011-12-15
著者
-
Inoue Junya
Department Of Civil Engineering The University Of Tokyo
-
Koseki Toshihiko
Dep. Of Materials Engineering The Univ. Of Tokyo
-
Koseki Toshihiko
Department Of Materials Engineering School Of Engineering The University Of Tokyo
-
Inoue Junya
Department Of Materials Engineering School Of Engineering The University Of Tokyo
-
Nambu Shoichi
Department Of Engineering The University Of Tokyo
-
Nambu Shoichi
Department Of Materials Engineering School Of Engineering The University Of Tokyo
-
LEE Changjoon
Department of Materials Engineering, The University of Tokyo
-
Lee Changjoon
Department Of Materials Engineering The University Of Tokyo
関連論文
- EXPERIMENTAL STUDY OF STRAIN RATES EFFECTS ON STRAIN LOCALIZATION CHARACTERISTICS OF SOFT ROCKS
- Estimation of Hydraulic Property of Jointed Rock Mass Considering Excavation-Induced Change in Permeability of Each Joints (IWS-ATHENS 2003「地盤力学における予測とシュミレーション手法」特集号)
- Effects of Boron, Niobium and Titanium on Grain Growth in Ultra High Purity 18% Cr Ferritic Stainless Steel
- Abnormal αto γ Transformation Behavior of Steels with a Martensite and Bainite Microstructure at a Slow Reheating Rate
- Reactive Transient Liquid Phase Bonding between AZ31 Magnesium Alloy and Low Carbon Steel
- Monitoring of Acoustic Emission Activity of Smart Stress Memory Patch to Estimate Maximum Fatigue Stress for Structural Health Monitoring
- Solidification of Iron and Steel on Single-crystal Oxide
- Scattering in Fatigue Crack Growth of Thin Pure Copper Sheet for Smart Stress Memory Patch
- Smart Stress-Memory Patch for Fatigue Damage of Structure
- W03I Development of stress memory patch(International Workshop on "New Frontiers of Smart Materials and Structural Systems")
- Ferrite Formation Behaviors from B1 Compounds in Steels
- Effect of Chromium, Aluminum and Nickel on Microstructure and Reverse-S Type Creep Rupture Strength of High Cr Ferritic Heat Resistant Steels
- Material Consideration on Ta, Mo, Ru, and Os as Glue Layer for Ultra Large Scale Integration Cu Interconnects