Effects of Post-Plating Reflow on Changes in Crystal Grain Size of Sn-2mass%Bi Alloy Plating with Thermal Cycling Treatment
スポンサーリンク
概要
- 論文の詳細を見る
- 2010-10-01
著者
-
KUWANO Noriyuki
Art, Science and Technology Center for Cooperative Research, Kyushu University
-
Sosiati Harini
The Res. Lab. For High Voltage Electron Microscopy Kyushu Univ.
-
JINNOUCHI Atsushi
Department of Applied Science for Electronics and Materials, Kyushu University
-
HORIKAMI Sadanori
Department of Applied Science for Electronics and Materials, Kyushu University
-
HIROKADO Naruyoshi
Department of Applied Science for Electronics and Materials, Kyushu University
-
Horikami Sadanori
Department Of Applied Science For Electronics And Materials Kyushu University
-
Jinnouchi Atsushi
Department Of Applied Science For Electronics And Materials Kyushu University
-
Hirokado Naruyoshi
Department Of Applied Science For Electronics And Materials Kyushu University
-
KUWANO Noriyuki
Art, Science and Technology Center for Cooperative Research
関連論文
- Effects of Post-Plating Reflow on Changes in Crystal Grain Size of Sn-2mass%Bi Alloy Plating with Thermal Cycling Treatment
- Changes in Microstructure of Al/AlN Interface during Thermal Cycling
- Removing focused ion-beam damages on transmission electron microscopy specimens by using a plasma cleaner
- Application of FIB microsampling technique to long-period ordered TiAl single crystal with composition gradient
- Application of a focused ion beam mill to the characterisation of a microstructure in tin plating on a Fe 42wt% Ni substrate