Ge/Si Heterojunction Photodiodes Fabricated by Low Temperature Wafer Bonding
スポンサーリンク
概要
- 論文の詳細を見る
Ge/Si heterojunctions are formed by wet wafer bonding at annealing temperatures of 250 or 350 °C. Photodiodes fabricated using Ge/Si heterojunctions exhibit photocurrents flowing over the heterojunction with an internal quantum efficiency higher than 80% at wavelengths between 1000 and 1550 nm. The measured photocurrent--voltage and capacitance--voltage characteristics reveal that the electrical property of the heterojunctions is the same as that for samples fabricated by higher temperature annealing.
- Japan Society of Applied Physicsの論文
- 2008-07-25
著者
-
Kanbe Hiroshi
Kochi University Of Technology
-
Miyaji Masayuki
Kochi University of Technology, Tosayamada-cho, Kami, Kochi 782-8502, Japan
-
Ito Tatsuya
Kochi University of Technology, Tosayamada-cho, Kami, Kochi 782-8502, Japan
-
Ito Tatsuya
Kochi University Of Technology
-
Miyaji Masayuki
Kochi University Of Technology
関連論文
- Ge/Si Heterojunction Photodiodes Fabricated by Low Temperature Wafer Bonding
- Investigation of Wafer-Bonded InAs/Si Heterojunction by Transmission Electron Microscopy