Thinning technology for lithium niobate wafer by surface activated bonding and chemical mechanical polishing
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概要
- 論文の詳細を見る
- 2005-09-13
著者
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Horng R.
Institute Of Precision Engineering National Chung Hsing University
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Wu C.
Department Of Materials Engineering National Chung Hsing University
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CHEN T.
Institute of Physics, Academia Sinica
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Wuu D.
Institute Of Precision Engineering National Chung Hsing University
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Wuu D.
Institute Of Electrical Engineering Da-yeh University
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Chou C.
Department Of Chemical Engineering University Of Waterloo
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Wu C.
Department And Institute Of Biology And Anatomy National Defense Medical Center
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Tsai H.
Mechanical Industry Research Laboratories Industrial Technology Research Institute
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TING C.
Mechanical Industry Research Laboratories, Industrial Technology Research Institute
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Chou C.
Department Of Mechanical Engineering National Chiao Tung University
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