SA-10-2(096) Sb-Sn and Zn-Sn Lead-Free Solders for CBGA(Life Prediction of Solder)
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概要
- 論文の詳細を見る
It is well known that thermal fatigue and creep are crucial factors affecting the life and the reliability of solder joints in microelectronic assembly. In this study, two types of lead-free solders, namely Sb5-Sn and Zn9-Sn, were used to compare their equivalent plastic strain with that of the eutectic lead-tin solder. In particular, soldering was applied to the top and bottom solder fillets of the balls in a ceramic ball grid array (CBGA) package onto a BT laminate. The analysis was carried out using finite element method, with the CBGA assembly subjected to 5 thermal cycles. The results revealed that in implementing lead-free interconnection, the use of lead-free solders and balls were required, but had led to an increase in creep strain in the solder fillet between the balls and the BT laminate. This means that the use of lead-free interconnection material, including solder, may provide earlier creep failure than the case with lead-tin materials.
- 一般社団法人日本機械学会の論文
- 2001-06-03
著者
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Wu C.
Department Of Physics And Materials Science City University Of Hong Kong
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Lai Joseph
Department of Physics and Materials Science, City University of Hong Kong
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Yeung N.
Department of Physics and Materials Science, City University of Hong Kong
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Lai Joseph
Department Of Physics And Materials Science City University Of Hong Kong
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Wu C.
Department Of Materials Engineering National Chung Hsing University
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Wu C.
Department Of Chemistry National Taiwan University
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Yeung N.
Department Of Physics And Materials Science City University Of Hong Kong
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Wu C.
Department And Institute Of Biology And Anatomy National Defense Medical Center
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- SA-10-2(096) Sb-Sn and Zn-Sn Lead-Free Solders for CBGA(Life Prediction of Solder)
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