Recovery of Process-induced Damages of Porous Silica Low-k Films by TMCTS Vapor Annealing
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概要
- 論文の詳細を見る
- 2004-09-15
著者
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Kikkawa T.
Mirai Advanced Semiconductor Research Center National Institute Of Advanced Industrial Science And T
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FUJII N.
MIRAI, Association of Super-Advanced Electronics Technologies (ASET)
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SONODA Y.
MIRAI, Association of Super-Advanced Electronics Technologies (ASET)
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Seino Y.
Mirai Association Of Super-advanced Electronics Technologies (aset)
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OKU Y.
MIRAI, Association of Super-Advanced Electronics Technologies (ASET)
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TAKASU Y.
Advanced Semiconductor Research Center, National Institute of Advanced Industrial Science and Techno
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TAKAHASHI H.
MIRAI, Association of Super-Advanced Electronics Technologies (ASET)
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GOTO T.
MIRAI, Association of Super-Advanced Electronics Technologies (ASET)
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MIYOSHI H.
MIRAI, Association of Super-Advanced Electronics Technologies (ASET)
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TAKADA S.
Advanced Semiconductor Research Center, National Institute of Advanced Industrial Science and Techno
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Takasu Y.
Advanced Semiconductor Research Center National Institute Of Advanced Industrial Science And Technol
関連論文
- Comparative Studies of Pore Seal Films for Porous-Silica / Cu Interconnect
- Recovery of Process-induced Damages of Porous Silica Low-k Films by TMCTS Vapor Annealing
- Characterization of Pore Size Distributions in Ultralow-k Films