Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2007-08-01
著者
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HON Min-Hsiung
Department of Materials Science and Engineering, National Cheng Kung University
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LI Wang-Long
Department of Mechanical Engineering National Cheng Kung University
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Li Wang-long
Department Of Mechanical Engineering National Kaohsiung University Of Applied Sciences
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Hon Min-hsiung
Department Of Materials Engineering National Cheng Kung University
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Wang Moo-chin
Faculty Of Fragrance And Cosmetics Kaohsiung Medical University
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LIU Chih-Yao
Department of Materials Science and Engineering, National Cheng Kung University
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CHEN Ying-Ru
Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences
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Liu Chih-yao
Department Of Materials Science And Engineering National Cheng Kung University
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Chen Ying-ru
Department Of Mechanical Engineering National Kaohsiung University Of Applied Sciences
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