The Simulation of Shape Evolution of Solder Joints during Reflow Process and Its Experimental Validation

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概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文
• 2006-04-20

著者

• HWANG Weng-Sing

  Department of Materials Science and Engineering, National Cheng Kung University

• Hwang Weng-sing

  Department Of Materials Science And Engineering National Cheng Kung University

• Hwang Weng-sing

  Department Of Material Science And Engineering National Cheng Kung University

• CHOU Ya-Yun

  Department of Materials Science and Engineering, National Cheng Kung University

• CHANG Hung-Ju

  Department of Materials Science and Engineering, National Cheng Kung University

• KUO Jer-Haur

  Department of Materials Science and Engineering, National Cheng Kung University

• Chou Ya-yun

  Department Of Materials Science And Engineering National Cheng Kung University

• Kuo Jer-haur

  Department Of Materials Science And Engineering National Cheng Kung University

• Chang Hung-ju

  Department Of Materials Science And Engineering National Cheng Kung University

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