Uncooled Infrared Focal Plane Arrays Using Micromachining Technology
スポンサーリンク
概要
- 論文の詳細を見る
- 2001-09-25
著者
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KIMATA Masafumi
Advanced Technology R & D Center, Mitsubishi Electric Corporation
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Ishikawa Tomohiro
Advanced Technology R & D Center Mitsubishi Electric Corporation
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Ueno Masashi
Advanced Technology R & D Center Mitsubishi Electric Corporation
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NAKAKI Yoshiyuki
Advanced Technology R & D Center, Mitsubishi Electric Corporation
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YAGI Hirofumi
Advanced Technology R & D Center, Mitsubishi Electric Corporation
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HATA Hisatoshi
Advanced Technology R & D Center, Mitsubishi Electric Corporation
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KANEDA Osamu
Advanced Technology R & D Center, Mitsubishi Electric Corporation
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SONE Takanori
Advanced Technology R & D Center, Mitsubishi Electric Corporation
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Kimata Masafumi
Department Of Micro System Technology Ritsumeikan University
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Kaneda Osamu
Advanced Technology R & D Center Mitsubishi Electric Corporation
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Yagi Hirofumi
Advanced Technology R & D Center Mitsubishi Electric Corporation
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Sone Takanori
Advanced Technology R & D Center Mitsubishi Electric Corporation
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Hata Hisatoshi
Advanced Technology R&d Center Mitsubishi Electric Corporation
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Nakaki Yoshiyuki
Advanced Technology R&d Center Mitsubishi Electric Corporation
関連論文
- A Charge Balanced C-V Converter for a Differential Capacitance Sensor
- Uncooled Infrared Focal Plane Arrays Using Micromachining Technology
- Chip Scale Vacuum Packaging for Uncooled IRFPA
- Effect of Stacking Faults in Triangular Defects on 4H-SiC Junction Barrier Schottky Diodes
- Effect of Stacking Faults in Triangular Defects on 4H-SiC Junction Barrier Schottky Diodes (Special Issue : Solid State Devices and Materials)