Numerical Modeling of the Transient Liquid-phase Diffusion Bonding Process of Al Using Cu Filler Metal
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概要
- 論文の詳細を見る
- 2003-12-15
著者
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MOMONO Tadashi
Department of Materials Science and Engineering, Muroran Institute of Technology
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NARITA Toshio
Faculty of Engineering, Hokkaido University
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NATSUME Yukinobu
Graduate School of Engineering, Hokkaido University
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OHSASA Kenichi
Graduate School of Engineering, Hokkaido University
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Momono Tadashi
Department Of Materials Science And Engineering Muroran Institute Of Technology
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Narita T
Hokkaido Univ. Sapporo Jpn
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Narita Toshio
Graduate School Of Engineering Hokkaido University
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Ohsasa K
Graduate School Of Engineering Hokkaido University
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Ohsasa Kenichi
Graduate School Of Engineering Hokkaido University
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TAYU Yoshinori
Department of Materials Science and Engineering, Muroran Institute of Technology
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Tayu Yoshinori
Department Of Materials Science And Engineering Muroran Institute Of Technology
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NATSUME Yukinobu
Faculty of Engineering, Hokkaido University
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Natsume Y
Hokkaido Univ.
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Natsume Yukinobu
Graduate School Of Engineering Hokkaido University
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