Phase-field Simulation of Transient Liquid Phase Bonding Process of Ni Using Ni-P Binary Filler Metal

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概要

• 論文の詳細を見る
• 2003-05-01

著者

• OHSASA Kenichi

  Faculty of Engineering, Hokkaido University

• NARITA Toshio

  Faculty of Engineering, Hokkaido University

• Narita T

  Hokkaido Univ. Sapporo Jpn

• Ohsasa K

  Graduate School Of Engineering Hokkaido University

• Ohsasa K

  Faculty Of Engineering Hokkaido University

• NATSUME Yukinobu

  Faculty of Engineering, Hokkaido University

• Natsume Y

  Hokkaido Univ.

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• Peritectic Transformation in Low Carbon Steels Containing High Phosphorus Concentration
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• Growth Rate Constant and Chemical Diffusivity in Silicides Mo_5Si_3 and Ta_5Si_3
• Phase-field Simulation of Transient Liquid Phase Bonding Process of Ni Using Ni-P Binary Filler Metal
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