Growth Rate Constant and Chemical Diffusivity in Silicides Mo_5Si_3 and Ta_5Si_3

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Analysis of Growth Behavior of a Cellular and Dendritic Interface under a Constrained Growth Condition using a Phase-Field Model
Formation of Ni Aluminide Containing Hf by Simultaneous Electrodeposition of Al and Hf and Cyclic-Oxidation Resistance
Numerical Modeling of the Transient Liquid-phase Diffusion Bonding Process of Al Using Cu Filler Metal
Growth Rate Constant and Chemical Diffusivity in Silicides Mo_5Si_3 and Ta_5Si_3
Phase-field Simulation of Transient Liquid Phase Bonding Process of Ni Using Ni-P Binary Filler Metal
Aging Behavior of a Sn-Bi Eutectic Solder at Temperatures between 233 and 373 K
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Effect of the Electrodeposition Temperature on the Cyclic-Oxidation Resistance of Ni Aluminide Containing Zr Formed by Molten-Salt Electrodeposition

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