Characteristics of Indium Bump for Flip-Chip Bonding Used in Polymeric-Waveguide-Integrated Optical Interconnection Systems
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2004-08-30
著者
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Park Hyo-hoon
Optical Interconnection And Switching Laboratory Information And Communications University
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Jeon Duk
Department Of Materials Science And Engineering Korea Advanced Institute Of Science And Technology
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CHU Kun-Mo
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
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LEE Jung-Sub
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
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CHO Han
Optical Interconnection and Switching Laboratory, Information and Communications University
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RHO Byung
Optical Interconnection and Switching Laboratory, Information and Communications University
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