Park Hyo-hoon | Optical Interconnection And Switching Laboratory Information And Communications University
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概要
- 同名の論文著者
- Optical Interconnection And Switching Laboratory Information And Communications Universityの論文著者
関連著者
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Park Hyo-hoon
Optical Interconnection And Switching Laboratory Information And Communications University
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Jeon Duk
Department Of Materials Science And Engineering Korea Advanced Institute Of Science And Technology
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CHU Kun-Mo
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
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LEE Jung-Sub
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
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CHO Han
Optical Interconnection and Switching Laboratory, Information and Communications University
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RHO Byung
Optical Interconnection and Switching Laboratory, Information and Communications University
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Cho Han
Optical Interconnection And Switching Laboratory Information And Communications University
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Rho Byung
Optical Interconnection And Switching Laboratory Information And Communications University
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Chu Kun-mo
Department Of Materials Science And Engineering Korea Advanced Institute Of Science And Technology
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Lee Jung-sub
Department Of Materials Science And Engineering Korea Advanced Institute Of Science And Technology
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Jeon Duk
Department Of Materials Science And Engineering Korea Advanced Institute Of Science & Technology
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Lee Jung-Sub
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Guseong-dong, Yuseong, Daejeon 305-701, Korea
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Rho Byung
Optical Interconnection and Switching Laboratory, Information and Communications University, P. O. Box 77, Yuseong, Daejeon 305-600, Korea
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Park Hyo-Hoon
Optical Interconnection and Switching Laboratory, Information and Communications University, P. O. Box 77, Yuseong, Daejeon 305-600, Korea
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Chu Kun-Mo
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Guseong-dong, Yuseong, Daejeon 305-701, Korea
著作論文
- Characteristics of Indium Bump for Flip-Chip Bonding Used in Polymeric-Waveguide-Integrated Optical Interconnection Systems
- Characteristics of Indium Bump for Flip-Chip Bonding Used in Polymeric-Waveguide-Integrated Optical Interconnection Systems